“Biomass-based bioplastics, such as polylactic acid (PLA)** that is made of corn, have been drawing attention in recent years as new materials to replace conventional petroleum-based plastics, amid increasing interest and concern over environmental problems such as global warming and resource depletion. However, application of regular PLA to electronic devices is difficult as it has insufficient heat resistance and strength.
NEC succeeded in improving the heat resistance and strength of PLA by adding kenaf fiber to it, one measure for the prevention of global warming. Then together with UNITIKA it realized the durability of the new material by applying it to the components of a PC. More recent research carried out by both companies involved the further improvement of the characteristics of the kenaf fiber-reinforced PLA in order to allow its application to mobile phones. Its moisture resistance was improved by UNITIKA, using their commecialized PLA “TERRAMAC.” Fall impact*** durability was increased by adding a biomass-based flexibilizer and a reinforcing filler that NEC developed for this resin. In addition, moldability was further advanced by using original additives that were jointly developed by NEC and UNITIKA.
The newly developed bioplastic achieves the highest biomass ingredient ratio out of all bioplastics that are currently being used in electronic devices, with a ratio of approximately 90%. It simultaneously realizes a high level of fall impact durability, moldability and heat resistance****, which are all desired features for mobile phone casing.”
From the Japan’s Corporate Network press release.